Device including circuit board with different form factor terminal sets and assemblies including the same

ABSTRACT

Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. According to example embodiments, a solid state device (SSD) may include a circuit board, a connector, and a case. The circuit board may include a unibody board common to at least a first and a second form factor, first circuit board connection terminals of the first form factor on a front side of the board, and second circuit board connection terminals of the second form factor on a back side of the board. The connector may include connector connection terminals, where only one of the first circuit board connection terminals and the second circuit board connection terminals are connected to the connector connection terminals.

PRIORITY STATEMENT

This application is a continuation application of U.S. application Ser.No. 12/349,678, filed Jan. 7, 2009, which claims priority under 35U.S.C. §119 to Korean Patent Application No. 10-2008-0088919 filed onSep. 9, 2008, the contents of which are herein incorporated by referencein their entirety for all purposes.

BACKGROUND

1. Field

Example embodiments are directed to circuit boards, connectors, cases,circuit board assemblies, case assemblies, devices and methods ofmanufacturing the same.

2. Description of the Related Art

A Solid State Device (SSD) is a memory data storage device that utilizessolid state memory, for example, flash-type, non-volatile memory) tostore persistent data. SSDs are an alternative to conventional harddrives that have slower memory data access times due to moving parts,for example, rotating disks and/or other moving mechanical parts. Theabsence of moving parts in an SSD may improve electromagneticinterference (EMI), physical shock resistance, and/or reliability.However, SSDs may be more prone to electrostatic discharge (ESD)relative to a conventional servo motor found in a hard drive, where therecording surfaces may be made of a magnetic material that is moreESD-resistive. The ESD problem may be exacerbated by higher memorydensities.

SSDs may have many different structures, sizes, dimensions, volumes,interfaces, and/or compatibilities. Each set of characteristics may bereferred to as a form factor. Two examples are a 1.8 inch and 2.5 inchSerial Advanced Technology Attachment (SATA)-2 standard structures. Ineither structure, the SSD may include one or more of the following, aprinted circuit board, one or more controller integrated circuit (ICs),for example, fine-pitch ball grid array (FPBGA) controllers, one or moreNAND memory ICs, one or more mobile Synchronous Dynamic Random AccessMemory (SDRAM) ICs, one or more voltage detector, one or more voltageregulator, one or more heat sink, one or more diodes, one or moreconnectors, including input/output (I/O) pins and clock (for, examplecrystal) pins, and/or a case.

As a result of a plurality of hard drive specifications, many differentSSDs, having different interfaces, have been developed.

SUMMARY

Example embodiments are directed to circuit boards, connectors, cases,circuit board assemblies, case assemblies, devices and methods ofmanufacturing the same, which are common to at least two different formfactors.

Example embodiments are directed to a circuit board including a board,common to at least a first form factor and a second form factor, firstcircuit board connection terminals of the first form factor, and secondcircuit board connection terminals of the second form factor.

Example embodiments are directed to a circuit board assembly includingcircuit board including a board, common to at least a first form factorand a second form factor, first circuit board connection terminals ofthe first form factor, and second circuit board connection terminals ofthe second form factor and a connector including connector connectionterminals, where only one of the first circuit board connectionterminals and the second circuit board connection terminals areconnected to the connector connection terminals.

Example embodiments are directed to a device of a first or second formfactor including

a circuit board assembly including circuit board including a board,common to at least a first form factor and a second form factor, firstcircuit board connection terminals of the first form factor, and secondcircuit board connection terminals of the second form factor and aconnector including connector connection terminals, where only one ofthe first circuit board connection terminals and the second circuitboard connection terminals are connected to the connector connectionterminals and a case of the first form factor or the second factor.

Example embodiments are directed to a circuit board including a board,first circuit board connection terminals on the board, and secondcircuit board connection terminals on the board, mutually exclusive ofthe first circuit board connection terminals.

Example embodiments are directed to a case assembly including at least atop surface or a bottom surface, of a first form factor or a second formfactor, a connector, attached to the top surface or the bottom surface,the connector including first circuit board connection terminals of thefirst form factor and second circuit board connection terminals of thesecond form factor, and a securing element attached to the top surfaceor the bottom surface, the connector including connector connectionterminals, where only one of the first circuit board connectionterminals and the second circuit board connection terminals areconnected to the connector connection terminals.

Example embodiments are directed to a device of a first form factorincluding a case assembly including at least a top surface or a bottomsurface, of a first form factor or a second form factor, a connector,attached to the top surface or the bottom surface, the connectorincluding first circuit board connection terminals of the first formfactor and second circuit board connection terminals of the second formfactor, and a securing element attached to the top surface or the bottomsurface, the connector including connector connection terminals, whereonly one of the first circuit board connection terminals and the secondcircuit board connection terminals are connected to the connectorconnection terminals and a board, common to at least the first formfactor and the second form factor, including first circuit boardconnection terminals of the first form factor and second circuit boardconnection terminals of the second form factor, wherein the firstcircuit board connection terminals of the first form factor of the boardare connected to the first circuit board connection terminals of thefirst form factor of the connector and the board is secured to the caseby the securing element.

Example embodiments are directed to a device of a second form factorincluding a case assembly including at least a top surface or a bottomsurface, of a first form factor or a second form factor, a connector,attached to the top surface or the bottom surface, the connectorincluding first circuit board connection terminals of the first formfactor and second circuit board connection terminals of the second formfactor, and a securing element attached to the top surface or the bottomsurface, the connector including connector connection terminals, whereonly one of the first circuit board connection terminals and the secondcircuit board connection terminals are connected to the connectorconnection terminals and a board, common to at least the first formfactor and the second form factor, including first circuit boardconnection terminals of the first form factor and second circuit boardconnection terminals of the second form factor, wherein the firstcircuit board connection terminals of the first form factor of the boardare connected to the first circuit board connection terminals of thefirst form factor of the connector and the board is secured to the caseby the securing element.

Example embodiments are directed to a case assembly including at leastone of three sides, a top, and a bottom surface and a connector,connected to the at least one of three sides, the top, and the bottomsurface, the connector including connector connection terminals.

Example embodiments are directed to a device including a case of one ofa first form factor and a second form factor, a circuit board of thefirst form factor, first circuit board connection terminals of the firstform factor, and second circuit board connection terminals of the secondform factor.

Example embodiments are directed to a connector including firstconnector connection terminals of a first form factor and secondconnector connection terminals of a second form factor.

Example embodiments are directed to a method of manufacturing a commoncircuit board including providing a board, common to at least a firstform factor and a second form factor, forming first circuit boardconnection terminals of the first form factor on the board, and formingsecond circuit board connection terminals of the second form factor onthe board.

Example embodiments are directed to a method of connecting a commoncircuit board including providing a board, common to at least a firstform factor and a second form factor with first circuit board connectionterminals of the first form factor and second circuit board connectionterminals of the second form factor on the board, and connecting thecommon circuit board to an external device using only one of the firstconnection and second circuit board connection terminals.

Example embodiments are directed to method of manufacturing an assemblyor device by combining at least two of a circuit board, a connector, anda case to form any one of a circuit board assembly, a case assembly, ora device.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages of example embodiments willbecome more apparent by describing them in detailed with reference tothe accompanying drawings.

FIGS. 1-2 illustrate circuit boards in accordance with exampleembodiments.

FIGS. 3-7 illustrate portions of circuit boards in accordance withexample embodiments.

FIGS. 8A and 8B illustrate connectors usable with example embodiments.

FIG. 8C illustrates a connector in accordance with example embodiments.

FIGS. 9A and 9B illustrate circuit board assemblies including a circuitboard in accordance with example embodiments.

FIGS. 10A and 10B illustrate circuit board assemblies including acircuit board in accordance with example embodiments.

FIGS. 11A and 11B illustrate case assemblies including a connector inaccordance with example embodiments.

FIGS. 12A and 12B illustrate devices, for example, memory devicesincluding circuit board assemblies including circuit boards andconnectors and cases in accordance with example embodiments.

FIGS. 13A and 13B illustrate devices, for example, memory devicesincluding circuit boards and case assemblies including connectors andcases in accordance with example embodiments.

FIG. 14 illustrates an example embodiment including a memory controllerin accordance with example embodiments.

FIG. 15 illustrates another example embodiment including an interface inaccordance with example embodiments.

FIG. 16 illustrates an example memory card in accordance with exampleembodiments.

FIG. 17 illustrates an example portable device in accordance withexample embodiments.

FIG. 18 illustrates an example memory card and host system in accordancewith example embodiments.

FIG. 19 illustrates an example system in accordance with exampleembodiments.

FIG. 20 illustrates an example computer system in accordance withexample embodiments.

FIG. 21 illustrates a method of manufacturing a common circuit board inaccordance with example embodiments.

FIG. 22 illustrates a method of connecting a common circuit board inaccordance with example embodiments.

FIG. 23 illustrates a method of manufacturing an assembly or device inaccordance with example embodiments.

DETAILED DESCRIPTION

Detailed example embodiments are disclosed herein. However, specificstructural and/or functional details disclosed herein are merelyrepresentative for purposes of describing example embodiments. Theclaims may, however, may be embodied in many alternate forms and shouldnot be construed as limited to only example embodiments set forthherein.

It will be understood that when a component is referred to as being“on,” “connected to” or “coupled to” another component, it can bedirectly on, connected to or coupled to the other component orintervening components may be present. In contrast, when a component isreferred to as being “directly on,” “directly connected to” or “directlycoupled to” another component, there are no intervening componentspresent. As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, third,etc. may be used herein to describe various elements, components,regions, layers and/or sections, these elements, components, regions,layers and/or sections should not be limited by these terms. These termsare only used to distinguish one element, component, region, layer orsection from another element, component, region, layer or section. Thus,a first element, component, region, layer or section discussed belowcould be termed a second element, component, region, layer or sectionwithout departing from the teachings of example embodiments.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one component or feature's relationship to another component(s)or feature(s) as illustrated in the drawings. It will be understood thatthe spatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures.

The terminology used herein is for the purpose of describing particularexample embodiments only and is not intended to be limiting. As usedherein, the singular forms “a,” “an” and “the” are intended to includethe plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements, and/orcomponents.

Unless otherwise defined, all terms (including technical and/orscientific terms) used herein have the same meaning as commonlyunderstood by one of ordinary skill in the art to which exampleembodiments belong. It will be further understood that terms, such asthose defined in commonly used dictionaries, should be interpreted ashaving a meaning that is consistent with their meaning in the context ofthe relevant art and will not be interpreted in an idealized or overlyformal sense unless expressly so defined herein.

Reference will now be made to example embodiments, which are illustratedin the accompanying drawings, wherein like reference numerals refer tothe like components throughout. Example embodiments should not beconstrued as limited to the particular shapes of regions illustrated inthese figures but are to include deviations in shapes that result, forexample, from manufacturing.

FIG. 1 illustrates a circuit board 110 in accordance with exampleembodiments. The circuit board 110 may include a common board 100, Nconnection pads 15, 17 (where N is an integer≧2) and N connectionterminals 115, 117. In example embodiments, illustrates in FIG. 1, thecircuit board 110 includes two circuit board connection pads 15 and 17,each including circuit board connection terminals 115, 117,respectively. In example embodiments, the first circuit board connectionterminals 115 may be of a first form factor and the second circuit boardconnection terminals 117 may be of a second form factor.

As shown, the circuit board 110 may be a common circuit board, namely acircuit board that may be used with other components of the first formfactor or other components of the second form factor. In exampleembodiments, the other components may be circuit board assemblies,connectors, cases, or case assemblies.

As shown, the circuit board 110 may also be a common circuit board,namely a circuit board that may be a component of a device of the firstform factor or a device of the second form factor. In exampleembodiments, the device may be a memory device, for example, a memorycard.

In example embodiments, the circuit board connection terminals 115, 117may be on different sides of the circuit board 110. For example, asshown in FIG. 1, the first circuit board connection terminals 115 are ona front side of the circuit board 110 and the second circuit boardconnection terminals 117 are on a back side of the circuit board 110. Inother example embodiments, the circuit board connection terminals 115,117 may be on the same side of the circuit board 110.

In example embodiments, the circuit board connection terminals 115, 117may be on the same end of the circuit board 110. For example, as shownin FIG. 1, the first circuit board connection terminals 115 and thesecond circuit board connection terminals 117 are on the same end of thecircuit board 110. In other example embodiments, the circuit boardconnection terminals 115, 117 may be different or opposite ends of thecircuit board 110.

In example embodiments as shown in FIG. 2, the circuit board connectionterminals 115, 117 may be on different sides and different ends of thecircuit board 110.

In example embodiments, the location of the first circuit boardconnection terminals 115 and the second circuit board connectionterminals 117 may be reversed. In example embodiments, the first circuitboard connection terminals 115 and the second circuit board connectionterminals 117 may be on the same side of circuit board 110 or ondifferent (for example, opposite) sides of the circuit board 110.

FIG. 3 illustrates a portion of a circuit board 110 in accordance withexample embodiments. In example embodiments, the first circuit boardconnection terminals 115 may be located on an edge 118 of the circuitboard 110 and the second circuit board connection terminals 117 may beoffset a distance x in an x-direction from the edge of circuit board110. In example embodiments, x is less than a length of the firstcircuit board connection terminals 115 in the x-direction.

In example embodiments shown in FIG. 3, a first terminal area 121 and asecond terminal area 123 overlap in the x-direction.

In other example embodiments, the first circuit board connectionterminals 115 may be offset a first distance x₁ in the x-direction fromthe edge of circuit board 110 and the second circuit board connectionterminals 117 may be offset a second distance x₂ in the x-direction fromthe edge of circuit board 110. In other example embodiments, the firstcircuit board connection terminals 115 and the second circuit boardconnection terminals 117 may be located on the edge 118 of the circuitboard 110. In example embodiments, x₁ and/or x₂ may be less than alength of the first circuit board connection terminals 115 and/or thesecond circuit board connection terminals 117 in the x-direction.

FIGS. 4-7 illustrate portions of circuit boards in accordance withexample embodiments. In example embodiments, the first circuit boardconnection terminals 115, including first end circuit board connectionterminals 115 a, 115 b may be located in the first terminal area 121 andthe second circuit board connection terminals 117, including second endcircuit board connection terminals 117 a, 117 b may be located in thesecond terminal area 123.

In example embodiments shown in FIG. 4, the first circuit boardconnection terminals 115 may be located on the edge 118 of the circuitboard 110 and the second circuit board connection terminals 117 may beoffset a distance x in an x-direction from the edge of circuit board110. In example embodiments, x is greater than or equal to a length ofthe first circuit board connection terminals 115 in the x-direction.

In example embodiments shown in FIG. 4, the first terminal area 121 andthe second terminal area 123 do not overlap in the x-direction.

In example embodiments, the first circuit board connection terminals 115may be offset a first distance x₁ in an x-direction from the edge ofcircuit board 110 and the second circuit board connection terminals 117may be offset a second distance x₂ in an x-direction from the edge ofcircuit board 110. In example embodiments, x₁ and/or x₂ may be greaterthan or equal to a length of the first circuit board connectionterminals 115 and/or the second circuit board connection terminals 117in the x-direction.

In example embodiments shown in FIG. 4, the first circuit boardconnection terminals 115 and the second circuit board connectionterminals 117 may also be offset in the y-direction. For example, thefirst circuit board connection terminals 115 and the second circuitboard connection terminals 117 are staggered as shown in FIG. 4, withthe first terminal area 121 beginning before the second terminal area123 and ending before the second terminal area 123 in the y-direction.

In example embodiments shown in FIG. 4, individual first circuit boardconnection terminals 115 and individual second circuit board connectionterminals 117 do not overlap in the y-direction.

In example embodiments shown in FIG. 5, the first circuit boardconnection terminals 115 may be located on an edge 118 of the circuitboard 110 and second circuit board connection terminals 117 may beoffset a distance x in an x-direction from the edge of circuit board110. In example embodiments, the first circuit board connectionterminals 115 may be offset a first distance x₁ in an x-direction fromthe edge of circuit board 110 and second circuit board connectionterminals 117 may be offset a second distance x₂ in an x-direction fromthe edge of circuit board 110.

In example embodiments shown in FIG. 5, the first terminal area 121 andthe second terminal area 123 do not overlap in the x-direction.

In example embodiments shown in FIG. 5, the first circuit boardconnection terminals 115 and the second circuit board connectionterminals 117 are not offset in the y-direction. For example, the firstcircuit board connection terminals 115 and the second circuit boardconnection terminals 117 are not staggered as shown in FIG. 4, with thefirst terminal area 121 beginning and ending at the same location as thesecond terminal area 123 in the y-direction.

In example embodiments shown in FIG. 6, the first circuit boardconnection terminals 115 may be located on an edge 118 of the circuitboard 110 and the second circuit board connection terminals 117 may alsobe located on the edge of circuit board 110. In example embodiments, thefirst circuit board connection terminals 115 may be offset a firstdistance x₁ in an x-direction from the edge of circuit board 110 andsecond circuit board connection terminals 117 may also be offset thefirst distance x₁ in an x-direction from the edge of circuit board 110.

In example embodiments shown in FIG. 6, the first terminal area 121 andthe second terminal area 123 substantially overlap in the x-direction.

In example embodiments shown in FIG. 6, individual first circuit boardconnection terminals 115 and individual second circuit board connectionterminals 117 are offset in the y-direction. For example, the firstcircuit board connection terminals 115 and the second circuit boardconnection terminals 117 are staggered as shown in FIG. 6, with thefirst terminal area 121 beginning before the second terminal area 123and ending before the second terminal area 123 in the y-direction.

In example embodiments shown in FIG. 7, the first circuit boardconnection terminals 115 and the second circuit board connectionterminals 117 may be arranged substantially the same as shown in FIG. 6.However, instead of the first circuit board connection terminals 115 andthe second circuit board connection terminals 117 alternating, as shownin FIG. 6, the first circuit board connection terminals 115 and thesecond circuit board connection terminals 117 may be grouped in anyfashion. For example, as specifically shown in area A, first circuitboard connection terminals 115 and/or second circuit board connectionterminals 117 may be grouped together or alternately.

As discussed above, circuit boards in accordance with exampleembodiments may include any or all of the above features. As a result,circuit boards in accordance with example embodiments may be useable ascommon circuit boards with various other components of the same ordifferent form factors. Circuit boards in accordance with exampleembodiments may be useable as a component of a device of the same ordifferent form factors. In example embodiments, the device may be amemory device, for example, a memory card.

FIGS. 8A and 8B illustrate connectors usable with example embodiments.FIG. 8A illustrates a connector 130 of a first form factor. Theconnector 130 of the first form factor may be connectable to any exampleembodiment of the common circuit board 110 discussed above. Theconnector 130 may include connector connection terminals 133. Theconnector connection terminals 133 may be connectable to the firstcircuit board connection terminals 115 of the first form factor of thecircuit board 110. In such a configuration, the second circuit boardconnection terminals 117 of the circuit board 110 may be unconnected.The connector 130 may also include an interface 160 for connection toother devices of the first form factor.

FIG. 8B illustrates a connector 132 of a second form factor. Theconnector 132 of the second form factor may be connectable to anyexample embodiment of the common circuit board 110 discussed above. Theconnector 132 may include connector connection terminals 133′. Theconnector connection terminals 133′ may be connectable to the secondcircuit board connection terminals 117 of the second form factor of thecircuit board 110. In such a configuration, the first circuit boardconnection terminals 115 of the circuit board 110 may be unconnected.The connector 130 may also include an interface 162 for connection toother devices of the second form factor.

In other example embodiments as shown in FIG. 8C, the connector 130/132may be common to the first form factor and the second form factor, inwhich case, the connector connection terminals 133 are connectable tothe first circuit board connection terminals 115 or the connectorconnection terminals 133′ are connectable to the second circuit boardconnection terminals 117.

FIGS. 9A and 9B illustrate circuit board assemblies including a circuitboard in accordance with example embodiments.

FIG. 9A illustrates a circuit board assembly 210 including a circuitboard 110 in accordance with example embodiments. As shown in FIG. 9A,one or more memory modules 111, for example, NAND flash packages, may beconnected to the circuit board 110. The first circuit board connectionterminals 115 of the circuit board 110 may be connected to connectorconnection terminals 133 of a connector 130 via a conductor 125, forexample, one or more solder balls or solder paste. In exampleembodiments shown in FIG. 9A, the connector 130 may be of the first formfactor, in which case, the connector connection terminals 133 areconnectable to the first circuit board connection terminals 115. In suchan assembly, the second circuit board connection terminals 117 may beunconnected.

FIG. 9B illustrates a circuit board assembly 212 including a circuitboard 110 in accordance with example embodiments. As shown in FIG. 9B,one or more memory modules 111, for example, NAND flash packages, may beconnected to the circuit board 110. The second circuit board connectionterminals 117 of the circuit board 110 may be connected to connectorconnection terminals 133′ of a connector 132 via a conductor 125, forexample, one or more solder balls or solder paste. In exampleembodiments, the connector 132 may be of the second form factor, inwhich case, the connector connection terminals 133′ of the connector areconnectable to the second circuit board connection terminals 117. Insuch an assembly, the first circuit board connection terminals 115 maybe unconnected.

FIGS. 10A and 10B illustrate circuit board assemblies including acircuit board in accordance with example embodiments.

FIG. 10A illustrates a circuit board assembly 210′ including a circuitboard 110 in accordance with example embodiments. The circuit boardassembly 210′ of FIG. 10A is similar to that of the circuit boardassembly 210 of FIG. 9A, except that instead of solder balls or solderpaste, a mechanical adapter connector 170 including a non-conductivepart 180 and a conductive part 190, is used to connect the connectorconnection terminals 133 to the first circuit board connection terminals115. Similar to the circuit board assembly 210 of FIG. 9A, the secondcircuit board connection terminals 117 may be unconnected.

FIG. 10B illustrates a circuit board assembly 220′ including a circuitboard 110 in accordance with example embodiments. The circuit boardassembly 220′ of FIG. 10B is similar to that of the circuit boardassembly 220 of FIG. 9B, except that instead of solder balls or solderpaste, a mechanical adapter connector 172 including a non-conductivepart 182 and a conductive part 192, is used to connect the connectorconnection terminals 133′ to the second circuit board connectionterminals 117. Similar to the circuit board assembly 220 of FIG. 9B, thefirst circuit board connection terminals 115 may be unconnected.

Any or all of the circuit board features discussed above with respect toFIGS. 1-7 may be applied to the circuit board assemblies 210, 220, 210′,or 220′.

FIGS. 11A and 11B illustrate case assemblies including a connector inaccordance with example embodiments.

FIG. 11A illustrates a case assembly 220 including a connector 130 and acase 140 in accordance with example embodiments. The connector 130 maybe any example embodiment of a connector discussed above. The case 140may include at least one of three sides, a top, and/or a bottom surfaceelement. As shown in FIG. 11A, the case 140 includes three side surfaceelements 145, but no top surface element and no bottom surface element.In example embodiments, the connector 130 and the case 140, and hence,the case assembly 220 itself, are both of the same (for example, thefirst) form factor.

FIG. 11B illustrates a case assembly 222 including a connector 132 and acase 142 in accordance with example embodiments. The connector 132 maybe any example embodiment of the connector 132 discussed above. The case140 may include at least one of three sides, a top, and/or a bottomsurface element. As shown in FIG. 11B, the case 142 includes three sidesurface elements 146, but no top surface element and no bottom surfaceelement. In example embodiments, the connector 132 and the case 142, andhence, the case assembly 222 itself, are both of the same (for example,the second) form factor.

In other example embodiments, for example, similar to those shown inFIG. 8C, the connector 130/132 of the case assembly 220/222 may becommon to the first form factor and the second form factor, in whichcase, the connector 130/132 may include connector connection terminals133 connectable to first circuit board connection terminals 115 andconnector connection terminals 133′ connectable to second circuit boardconnection terminals 117. Similarly, the connector 130/132 may includethe interface 160 for connection to other devices of the first formfactor and/or the interface 162 for connection to other devices of thesecond form factor.

In other example embodiments, for example, similar to those shown inFIG. 8C, the case 140/142 may be common to the first form factor and thesecond form factor in which case, the case 140/142 may accommodate aconnector 130 and/or a connector 132.

FIGS. 12A and 12B illustrate devices, for example, memory devicesincluding circuit board assemblies including circuit boards andconnectors and cases in accordance with example embodiments.

FIG. 12A illustrates a device, for example, a memory device 310including circuit board assembly 210 including circuit board 110 andcase 140 in accordance with example embodiments. As shown in FIG. 12A, amemory device 310 of a first form factor may be formed by combining acircuit board assembly 210 including a circuit board 110 including firstcircuit board connection terminals 115 of the first form factor andsecond circuit board connection terminals 117 of the second form factorand a connector 130 including connector connection terminals 133,connectable to the first circuit board connection terminals 115 of thefirst form factor with a case 140 of the first form factor. In such adevice, the second circuit board connection terminals 117 may beunconnected. As shown in FIG. 12A, the case 140 includes four sidesurface elements 145 and a top surface element and/or a bottom surfaceelement.

FIG. 12B illustrates a device, for example, a memory device 312including circuit board assembly 212 including circuit board 110 andcase 142 in accordance with example embodiments. As shown in FIG. 12B,the memory device 312 of the second form factor may be formed bycombining a circuit board assembly 212 including a circuit board 110including first circuit board connection terminals 115 of the first formfactor and second circuit board connection terminals 117 of the secondform factor and a connector 132 including connector connection terminals133′, connectable to the second circuit board connection terminals 117of the second form factor with a case 142 of the second form factor. Insuch a device, the first circuit board connection terminals 115 may beunconnected. As shown in FIG. 12B, the case 142 includes four sidesurface elements 146 and a top surface element and/or a bottom surfaceelement.

Any or all of the circuit board features discussed above with respect toFIGS. 1-7 may be applied to the circuit board assemblies 210, 212. Anyor all of the circuit board assembly features discussed above withrespect to FIGS. 9A-10B may be applied to the devices 310, 312.

In other example embodiments, for example, similar to those shown inFIG. 8C, the connector 130/132 may be common to the first form factorand the second form factor, in which case, the connector 130/132 mayinclude connector connection terminals 133 connectable to first circuitboard connection terminals 115 and connector connection terminals 133′connectable to second circuit board connection terminals 117. Similarly,the connector 130/132 may include the interface 160 for connection toother devices of the first form factor and/or the interface 162 forconnection to other devices of the second form factor.

In other example embodiments, for example, similar to those shown inFIG. 8C, the case 140/142 may be common to the first form factor and thesecond form factor in which case, the case 140/142 may accommodate acircuit board assembly 210 and/or a circuit board assembly 212.

FIGS. 13A and 13B illustrate devices, for example, memory devicesincluding circuit boards and case assemblies including connectors andcases in accordance with example embodiments.

FIG. 13A illustrates a device, for example, a memory device 410including a case assembly 220′ and circuit board 110 in accordance withexample embodiments. As shown in FIG. 13A, a memory device 410 of afirst form factor may be formed by combining a case assembly 220′ of thefirst form factor with the circuit board 110. The case assembly 220′ ofthe first form factor may include a surface element 200 of the firstform factor and a connector 130 of the first form factor. The circuitboard 110 may include the first circuit board connection terminals 115of the first form factor and the second circuit board connectionterminals 117 of the second form factor. The connector 130 of the firstform factor may include connector connection terminals 133. Theconnector connection terminals 133 may be connectable to the firstcircuit board connection terminals 115 of the first form factor. In sucha device, the second circuit board connection terminals 117 may beunconnected.

In example embodiments, the case assembly 220′ may further include oneor more securing elements 210, configured to secure the circuit board110 to the surface element 200. In example embodiments, the one or moresecuring elements 210 may be guide rails, by which the circuit board 110may be secured.

In example embodiments, the surface element 200 may be a top element ora bottom element.

FIG. 13B illustrates a device, for example, a memory device 412including a case assembly 222′ and circuit board 110 in accordance withexample embodiments. As shown in FIG. 13B, a memory device 412 of asecond form factor may be formed by combining a case assembly 222′ ofthe second form factor with the circuit board 110. The case assembly222′ of the second form factor may include a surface element 202 of thesecond form factor and a connector 130 of the second form factor. Thecircuit board 110 may include the first circuit board connectionterminals 115 of the first form factor and the second circuit boardconnection terminals 117 of the second form factor. The connector 132 ofthe second form factor may include connector connection terminals 133′.The connector connection terminals 133′ may be connectable to the secondcircuit board connection terminals 117 of the second form factor. Insuch a device, the first circuit board connection terminals 115 may beunconnected.

In example embodiments, the case assembly 222′ may further include oneor more securing elements 212, configured to secure the circuit board110 to the surface element 202. In example embodiments, the one or moresecuring elements 212 may be guide rails, by which the circuit board 110may be secured.

In example embodiments, the surface element 202 may be a top element ora bottom element.

Any or all of the case assembly features discussed above with respect toFIGS. 11A-11B may be applied to the memory device 410, 412.

In other example embodiments, for example, similar to those shown inFIG. 8C, the connector 130/132 may be common to the first form factorand the second form factor, in which case, the connector 130/132 mayinclude connector connection terminals 133 connectable to first circuitboard connection terminals 115 and connector connection terminals 133′connectable to second circuit board connection terminals 117. Similarly,the connector 130/132 may include the interface 160 for connection toother devices of the first form factor and/or the interface 162 forconnection to other devices of the second form factor.

Example embodiments of circuit boards, connectors, cases, circuit boardassemblies, case assemblies, and/or devices, as discussed above may beimplemented as components or sub-components in one or more sub-system orsystem as described in more detail below.

FIG. 14 illustrates an example embodiment including a memory controllerin accordance with example embodiments. As shown, FIG. 14 includes amemory 510 connected to a memory controller 520. The memory 510 may be aNAND flash memory or NOR flash memory. However, the memory 510 is notlimited to these memory types, and may be any memory type.

The memory controller 520 may supply the input signals for controllingoperation of the memory 510. For example, in the case of a NAND flashmemory, the memory controller 520 may supply the command CMD and addresssignals. In examples of a NOR flash memory, the memory controller 520may supply CMD, ADD, DQ and VPP signals. It will be appreciated that thememory controller 520 may control the memory 510 based on receivedcontrol signals (not shown).

FIG. 15 illustrates another example embodiment including an interface inaccordance with example embodiments. As shown, FIG. 15 includes a memory510 connected to an interface 515. The memory 510 may be a NAND flashmemory or a NOR flash memory. However, the memory 510 is not limited tothese memory types, and may be any memory type.

The interface 515 may supply the input signals (for example, generatedexternally) for controlling operation of the memory 510. For example, inthe case of a NAND flash memory, the interface 515 may supply thecommand CMD and address signals. In the example of a NOR flash memory,the interface 515 may supply CMD, ADD, DQ and VPP signals. It will beappreciated that the interface 515 may control the memory 510 based onreceived control signals (for example, generated externally, but notshown).

FIG. 16 illustrates an example memory card in accordance with exampleembodiments. FIG. 16 is similar to FIG. 14, except that the memory 510and memory controller 520 have been embodied as a card 530. For example,the card 530 may be a memory card such as a flash memory card. Namely,the card 530 may be a card meeting any industry standard for use with aconsumer electronics device such as a digital camera, personal computer,etc. It will be appreciated that the memory controller 520 may controlthe memory 510 based on controls signals received by the card 530 fromanother (e.g., external) device.

FIG. 17 illustrates an example portable device in accordance withexample embodiments. FIG. 17 represents a portable device 6000. Theportable device 6000 may be an MP3 player, video player, combinationvideo and audio player, etc. As shown, the portable device 6000 includesthe memory 510 and memory controller 520. The portable device 6000 mayalso includes an encoder and decoder 610, presentation components 620and interface 630.

Data (video, audio, etc.) may be input to and output from the memory 510via the memory controller 520 by an encoder and decoder (EDC) 610. Asshown by the dashed lines in FIG. 28, the data may be directly input tothe memory 510 from the EDC 610 and/or directly output from the memory510 to the EDC 610.

The EDC 610 may encode data for storage in the memory 510. For example,the EDC 610 may perform MP3 encoding on audio data for storage in thememory 510. Alternatively, the EDC 610 may perform MPEG encoding (e.g.,MPEG2, MPEG4, etc.) on video data for storage in the memory 510. Stillfurther, the EDC 610 may include multiple encoders for encodingdifferent types of data according to different data formats. Forexample, the EDC 610 may include an MP3 encoder for audio data and anMPEG encoder for video data.

The EDC 610 may decode output from the memory 510. For example, the EDC610 may perform MP3 decoding on audio data output from the memory 510.Alternatively, the EDC 610 may perform MPEG decoding (e.g., MPEG2,MPEG4, etc.) on video data output from the memory 510. Still further,the EDC 610 may include multiple decoders for decoding different typesof data according to different data formats. For example, the EDC 610may include an MP3 decoder for audio data and an MPEG decoder for videodata.

It will also be appreciated that EDC 610 may include only decoders. Forexample, already encoded data may be received by the EDC 610 and passedto the memory controller 520 and/or the memory 510.

The EDC 610 may receive data for encoding, or receive already encodeddata, via the interface 630. The interface 630 may conform to a knownstandard (e.g., firewire, USB, etc.). The interface 630 may also includemore than one interface. For example, interface 630 may include afirewire interface, a USB interface, etc. Data from the memory 510 mayalso be output via the interface 630.

The presentation components 620 may present data output from the memory,and/or decoded by the EDC 610, to a user. For example, the presentationcomponents 620 may include a speaker jack for outputting audio data, adisplay screen for outputting video data, and/or etc.

FIG. 18 illustrates an example memory card and host system in accordancewith example embodiments in which the host system 7000 is connected tothe card 530 of FIG. 16. In example embodiments, the host system 7000may apply control signals to the card 530 such that the memorycontroller 520 controls operation of the memory 510.

FIG. 19 illustrates an example system in accordance with exampleembodiments. As shown, system 2000 may include a microprocessor 2100,user interface 2200, for example, a keypad, a keyboard, and/or adisplay, modem 2300, controller 2400, memory 2500 and/or battery 2600.In example embodiments, each of the system elements may be combined eachother through a bus 2001.

The controller 2400 may also include one or more microprocessors, adigital signal processor, a microcontroller, or any processor similar tothe above. The memory 2500 may be used to store data and/or commandsexecuted by the controller 2400. The memory 2500 may be any of any ofthe memories described in example embodiments above.

The modem 2300 may be used to transmit data to and/or from anothersystem, for example, a communication network. The system 2000 may bepart of a mobile system, such as a PDA, a portable computer, web tablet,a wireless phone, a mobile phone, a digital music player, memory card,or other system transmitting and/or receiving information.

FIG. 20 illustrates an example computer system in accordance withexample embodiments. As shown, the computer system 3000 may include oneor more power supplies 3002, one or more monitors 3004 (for example, aconventional and/or touch-screen monitor), one or more input devices3006, for example, a mouse, a keyboard, and/or a stylus, a main ormotherboard 3008, to which one or more components 3010 are attached. Theone or more sub-components 3010 may be one or more central processingunits (CPUs), one or more memories, and/or one or more cards. Thecomputer system 3000 may include one or more additional memories 3012,which may be removable or more easily removable.

In example embodiments, the computer system 3000 may be desktop,personal computer, a laptop personal computer, and/or a handheldpersonal computer. In example embodiments, the computer system 3000 maybe a server.

Example embodiments of circuit boards, connectors, cases, circuit boardassemblies, case assemblies, and/or devices, as discussed above may beimplemented as components or sub-components in one or more computersystem 3000, as described above.

FIG. 21 illustrates a method of manufacturing a common circuit board inaccordance with example embodiments. As shown in FIG. 21 at 2110, aboard 100 is provided that is common to at least a first form factor anda second form factor. At 2120, first circuit board connection terminals115 of the first form factor are formed on the board 100. At 2130,second circuit board connection terminals 117 of the second form factorare formed on the board 100.

FIG. 22 illustrates a method of connecting a common circuit board inaccordance with example embodiments. As shown in FIG. 22 at 2210, acircuit board 110 is provided that is common to at least a first formfactor and a second form factor. The circuit board 110 includes firstcircuit board connection terminals 115 of the first form factor andsecond circuit board connection terminals 117 of the second form factor.At 2220, the circuit board 110 is connected to an external device usingonly one of the first circuit board connection terminals 115 and secondcircuit board connection terminals 117.

FIG. 23 illustrates a method of manufacturing an assembly or device inaccordance with example embodiments. As shown in FIG. 23 at 2310, atleast two of a circuit board, for example, any of circuit boards 110discussed above, a connector, for example, any of connectors 130/132discussed above, and a case, for example, any of the cases 140/142discussed above, may be combined to form any one of the circuit boardassemblies 210, 212, 210′, 212′ discussed above, any one of the caseassemblies 220, 222 discussed above, or any one of the devices 310, 312,410, 412 discussed above.

As set forth above, any of circuit boards 110 discussed above may becombined with any of connectors 130/132 discussed above to form any ofthe circuit board assemblies 210, 212, 210′, 212′ discussed above. Anyof connectors 130/132 discussed above may be combined with any of thecases 140/142 discussed above to form any of the case assemblies 220,222 discussed above. Any of circuit boards 110 discussed above may becombined with any of the connectors 130/132 discussed above and any ofthe cases 140/142 discussed above to form any of the devices 310, 312,410, 412 discussed above.

In example embodiments, the circuit boards, connectors, cases, circuitboard assemblies, case assemblies, devices disclosed herein may be SSDs,for example, electronics with no moving parts, hence, less fragile thanhard disks, having no mechanical delays, and/or lower access timesand/or latency than electromechanical devices.

In example embodiments, the circuit boards, connectors, cases, circuitboard assemblies, case assemblies, devices disclosed herein may becomponents of flash memories, for example, NAND or NOR flash memories.In example embodiments, the circuit boards, connectors, cases, circuitboard assemblies, case assemblies, devices disclosed herein may becomponents of Multi-level cell (MLC) flash memory or Single-level cell(SLC) flash memory.

In example embodiments, the circuit boards, connectors, cases, circuitboard assemblies, case assemblies, devices disclosed herein may becomponents of DRAM memories.

While example embodiments discussed above refer to a first and secondform factor, each embodiments may implement M form factors, where M≧2.

In example embodiments, the first and second form factors are the 1.8inch and 2.5 inch SATA-2 standard structures. In example embodiments,the first and second form factors may be the 3.5-inch SATA-2 standardstructure or another structure, for example, a CompactFlash Type (forexample, Type I or II), SD memory card, miniSD, microSD, TransFlash,MultiMediaCard (MMC), MMCplus, RS-MMC, DV RS-MMC, MMCmobile, MMCmicro,Memory Stick, Memory Stick PRO, Memory Stick Duo, Memory Stick PRO Duo,SmartMedia Card, xD-Picture Card, PC Card (for example, Types I, II, orIII), and/or USB Flash Drive

Example embodiments being thus described, it will be obvious that thesame may be varied in many ways. Such variations are not to be regardedas a departure from example embodiments, and all such modifications areintended to be included within the scope of append claims.

What is claimed:
 1. A solid state device comprising: a circuit boardincluding, a unibody board, common to at least a first form factor and asecond form factor, the unibody board including a first end, firstcircuit board connection terminals of the first form factor on a frontside of the unibody board, and second circuit board connection terminalsof the second form factor on a back side of the unibody board; aconnector including connector connection terminals, the connectorincluding a first conductive part connected to the first circuit boardconnection terminals and a second conductive part connected to thesecond circuit board connection terminals, where only one of the firstcircuit board connection terminals and the second circuit boardconnection terminals are electrically connected to the connectorconnection terminals and one of the first conductive part and the secondconductive part electrically connects the one of the first circuit boardconnection terminals and the second circuit board connection terminalsto the connector connection terminals; and a case of one of the firstform factor and the second form factor, the case enclosing the circuitboard, wherein the case, the circuit board, and the connector areconfigured to form a part of a portable plug-in memory device with onlythe one of the first and second circuit board connection terminals beingused while the other of the first and second circuit board connectionterminals is to remain inactive, and the circuit board may be used fordifferent memory devices and joined to the connector to form thesolid-state device wherein only the one of the first and second circuitboard connection terminals are to be electrically used in the solidstate device.
 2. The SSD according to claim 1, wherein neither of thefirst circuit board connection terminals and the second circuit boardconnection terminals are exposed outside of the case.
 3. The SSDaccording to claim 1, wherein the one of the first circuit boardconnection terminals and the second circuit board connection terminalsare connected to the connector connection terminals via solder balls orsolder paste.
 4. The SSD according to claim 1, wherein the one of thefirst circuit board connection terminals and the second circuit boardconnection terminals is connected to the connector connection terminalsvia a mechanical adaptor connector.
 5. The SSD according to claim 1,wherein the connector and the case is integrated.
 6. The SSD accordingto claim 1, further comprising: one or more securing elements configuredto secure the circuit board to a surface element of the case.
 7. The SSDaccording to claim 6, wherein the one or more securing elements areguide rails.
 8. The SSD according to claim 1, further comprising: atleast one first connection pad on the front side of the unibody board,and at least one second connection pad on the back side of the unibodyboard.
 9. The SSD according to claim 8, wherein the at least one firstconnection pad includes the first circuit board connection terminals ofthe first form factor, and the at least one second connection padincludes the second circuit board connection terminals of the secondform factor.
 10. The SSD according to claim 1, wherein the first formfactor and the second form factor are different from each other.
 11. TheSSD according to claim 1, wherein the first circuit board connectionterminals of the first form factor and the second circuit boardconnection terminals of the second form factor are arranged near thefirst end of the board.
 12. The SSD of claim 1, wherein the first formfactor and the second form factor are different from each other, thefirst circuit board connection terminals and the second circuit boardconnection terminals are arranged near the first end of the unibodyboard, and the one of the first conductive part and the secondconductive part is the first conductive part electrically connecting thefirst circuit board connection tell finals to the connector connectionterminals.
 13. The SSD of claim 1, wherein the first form factor and thesecond form factor are different from each other, the first circuitboard connection terminals and the second circuit board connectionterminals are arranged near the first end of the unibody board, and theone of the first conductive part and the second conductive part is thesecond conductive part electrically connecting the second circuit boardconnection terminals to the connector connection terminals.
 14. The SSDof claim 1, wherein the first form factor and the second form factor aredifferent from each other, and the first form factor is a first-typeSATA-2 structure.
 15. A solid state device comprising: a circuit boardcomprising: a board common to at least a first form factor and a secondform factor; first circuit board connection terminals of the first formfactor; and second circuit board connection terminals of the second formfactor, a connector including connector connection terminals, where onlyone of the first circuit board connection terminals and the secondcircuit board connection terminals are connected to the connectorconnection terminals and the connector is common to the first formfactor and the second form factor; and a case of the first form factor;wherein the first circuit board connection terminals and the secondcircuit board connection terminals are configured such that when thefirst form factor operates only the first circuit board terminalselectrically contact an external device and when the second form factoroperates only the second circuit board terminals electrically contactthe external device, the case and the connector are configured to form apart of a portable plug-in memory device with only the one of the firstand second circuit board connection terminals being used while the otherof the first and second circuit board connection terminals is to remaininactive, and the circuit board may be used for different memory devicesand joined to the connector to form the solid-state device wherein onlythe one of the first and second circuit board connection terminals areto be electrically used in the solid state device.
 16. The SSD of claim15, wherein the first form factor comprises a first type SATA-2structure and the second form factor comprises a second type SATA-2structure.
 17. The SSD of claim 16, wherein the first type SATA-2structure is 1.8 inch SATA-2 structure and the second type SATA-2structure is 2.5 inch SATA-2 structure.
 18. The SSD of claim 17, whereinthe first form factor comprises a 3.5 inch SATA-2 standard structure andthe second form factor comprises a memory card.
 19. A solid state devicecomprising: a circuit board comprising: a board common to at least afirst form factor and a second form factor; first circuit boardconnection terminals of the first form factor; and second circuit boardconnection terminals of the second form factor, a connector includingconnector connection terminals, where only one of the first circuitboard connection terminals and the second circuit board connectionterminals are connected to the connector connection terminals and theconnector is common to the first form factor and the second form factor;and a case of the first form factor, wherein the first form factor andthe second form factors are configured such that when the first formfactor is in electrically on-state, the second form factor is inelectrically off-state, the case and the connector are configured toform a part of a portable plug-in memory device with only the one of thefirst and second circuit board connection terminals being used while theother of the first and second circuit board connection terminals is toremain inactive, and the circuit board may be used for different memorydevices and joined to the connector to form the solid-state devicewherein only the one of the first and second circuit board connectionterminals are to be electrically used in the solid state device.